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The WINDFORCE 3X cooling system features 3x 100mm unique blade fans, alternate spinning, vapor chamber, 8 composite copper heat pipes, 3D active fan and Screen cooling, which together provide high efficiency heat dissipation
Alternate Spinning can reduce the turbulence of adjacent fans and increase air pressure.
GIGABYTE turns the adjacent fans in the opposite direction, so that the airflow direction between the two fans is the same, reducing the turbulence and enhancing the airflow pressure.
The 3D Active Fan provides semi-passive cooling, and the fans will remain off when the GPU is in a low load or low power game.
By precisely fine-tuning the angle and the shape of the fan blades, coupling with the triangular fan edge and 3D stripe curve on the fan surface to smoothly guide the airflow, the upgraded cooling fans can generate a greater amount of air intake at the same fan speed.
The double ball bearing structure has better heat endurance and efficiency than sleeve structure.
Extended heatsink design allows air flow to pass through, providing better heat dissipation.
With direct contact to the GPU and VRAM, the large copper plate combines the composite heat pipes to efficiently transfer heat generated from the interior cores to the heat sink.
The metal back plate not only provides an aesthetical shape, but also enhances the structure of the graphics card to provide complete protection.
Silent mode will provide a quieter experience. The mode switch requires a reboot to take effect. The default is OC mode.
Support for NVIDIA NVLinkTM (NVIDIA SLI) technology, which combines 2 identical GPUs with an GeForce RTX NVLink Bridge to deliver the ultimate experience in 4K gaming or VR gaming.
Dust resistant shields from dust, insects, dropped screws, drill shavings, and abrasion. Moisture resistant prevents unwanted conduction paths and board damage. Corrosion resistant protects from salt spray, humidity, and corrosion
The graphics card uses the better power phase design to allow the MOSFET to operate at lower temperature, and over-temperature protection design and load balancing for each MOSFET, plus the Ultra Durable certified chokes and capacitors, to provide excellent performance and longer system life
Fully automated production process ensures top quality of the circuit boards and eliminates sharp protrusions of the solder connectors seen on the conventional PCB surface. This friendly design prevents your hands from getting cut or inadvertently damaging components when making your build.