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The heat radiation surface has been expanded 1.5x larger when compared with similar coolers. The wider heat dissipation area absorbs heat generated by the CPU and evenly distributes the heat throughout, making it possible to achieve 60W TDP in a compact size.
1.5x heat radiation area compared to other same volume coolers. Top-Down Blowing design cools not only the CPU but also the other components around the CPU.
Improving Performance with Ultra-Quiet 85mm PWM Fan.
Heat Element (A): Heat transfer path of common heat sink. Heat Element (B): Heat Transfer path of FHS (Flower Heat Sink). FHS provides a simple heat transfer path and larger heat dissipation area.
It features a wide heat dissipation structure compared to other compression-type heatsinks, and the heat generated from the CPU is evenly distributed throughout the heatsink, which made it possible to achieve 65W TDP in a compact size.